Package Design Engineer 2 - Hyderabad @ Xilinx

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Package Design Engineer 2 - Hyderabad

Xilinx
5 - 10 years
Hyderabad
4 years ago
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Job Description

In this key technical position, you will engage in the following undertakings, leveraging your package design expertise.
Design advanced and heterogeneous integration packages to meet/exceed package and system electrical and thermal performances
Develop new package solutions including pin-out definitions, DRC/DFX and stack-up requirements
Develop design automation and methodologies
Implement chip-package design flow and LVS verification
Provide packaging expertise to support succeeding processes: manufacturing, assembly, testing, reliability and VNC

Job requirements

Expertise in Cadence Allegro Package Designer, including constraints setup and design flow
Cadence skill programming experience is a plus
Experience in Cadence Allegro Sigrity/Clarity tools or other SI tools is a plus
Familiarity with IC design and verification tools such as Virtuoso, and Calibre; PCB design tools such as Allegro, and Xpedition; PCB/Package DFM tools such as Valor, and CAM350; Gerber/ODB++/GDSII conversion software such as Artwork; MCAD tool such as AutoCAD, and SolidWorks
Knowledge in SI/PI, SPICE, DDR, and SerDes channel modeling
Knowledge in stress and thermal modeling on microelectronics packaging
Knowledge in packaging assembly including 2.5D/3D, flipchip, WLP and wirebond
Knowledge in packaging substrate structures, and manufacturing processes and yield factors
Knowledge in microelectronics packaging testing reliability requirements
Good communication skills

Education Requirements

Bachelors or Masters in EE or related fields

Years of Experience

A minimum of 5 years of relevant experience in advanced package design

Job Classification

Industry: Electronic Components / Semiconductors
Functional Area: Engineering Design, R&D,
Role Category: Engineering Design
Role: Engineering Design
Employement Type: Full time

Education

Under Graduation: Any Graduate in Any Specialization
Post Graduation: Post Graduation Not Required
Doctorate: Doctorate Not Required

Contact Details:

Company: Xilinx
Location(s): Hyderabad

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Keyskills: Allegro Automation AutoCAD Design Engineer 2 thermal Tool design Wellness packaging design Cadence Allegro Testing

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Desired Industry (*):

Functional area / Department (*):

Enter Skills (key skills, subjects, technologies & roles to use in search)

Write briefly about yourself, your experience and education (*)

Attach ResumeMax 2.38 MB (RTF, PDF, DOC, DOCX formats only parsed)

Please, check the file size and type.

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Xilinx

Xilinx is the worlds leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs, enabling the next generation of smarter, connected, and differentiated systems and networks. Driven by the industry-wide shifts towards Cloud Computing, SDN/NFV, Video Everywhere, Embedded Vision, Industrial Io...

Package Design Engineer 2 - Hyderabad @ Xilinx

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