Job Overview: We are looking for an R&D Engineer with expertise in bonding wires to join our team. The primary focus of this role will be to study and analyse the market for bonding wire products, identify trends, and provide insights for product development and improvement. The ideal candidate will have experience in the OSAT (Outsourced Semiconductor Assembly and Test) industry or have worked closely in semiconductor packaging and assembly lines. Key Responsibilities: Conduct market research and competitive analysis to identify trends and customer needs in bonding wire technology. Study bonding wire materials and processes to suggest improvements and product enhancements. Collaborate with the manufacturing team to ensure alignment between market needs and production capabilities. Work with cross-functional teams to implement new bonding wire solutions and innovations. Support R&D initiatives with technical analysis and product optimisation. Requirements: 2-4 years of experience in R&D or production support, preferably in the OSAT or semiconductor packaging industry. Strong knowledge of bonding wires and their applications in electronics packaging. Experience in packaging and assembly processes is a plus Good analytical skills and ability to interpret market data for product development. Strong communication skills for effective collaboration with teams.,
Employement Category:
Employement Type: Full timeIndustry: Engineering / ConstructionRole Category: Not SpecifiedFunctional Area: Not SpecifiedRole/Responsibilies: Research And Development Specialist Job in GM