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Program Manager @ ACL Digital

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 Program Manager

Job Description


Job Overview:

Program Manager

The Program Manager for Chip Design will oversee the entire lifecycle of semiconductor design projects, from initial concept through to tape-out and GDSII handoff. The ideal candidate will ensure project deliverables meet time, cost, and quality objectives by coordinating cross-functional teams, managing resources, and aligning internal and external stakeholders. This role involves close collaboration with engineering, operations, and customer-facing teams, requiring both technical expertise and leadership abilities.


Key Responsibilities:

  • End-to-End Program Management:
  • Lead the planning, execution, and delivery of semiconductor chip design programs, managing the flow from RTL design to GDSII.
  • Oversee project milestones, timelines, and deliverables, ensuring alignment with business goals and customer requirements.
  • Track program progress using key performance indicators (KPIs) such as schedule, cost, quality, and risk.
  • Cross-Functional Team Leadership:
  • Coordinate with design, verification, DFT, physical design, and product engineering teams to ensure seamless execution of chip development.
  • Work closely with product marketing, software, and manufacturing teams to align on product goals and technical specifications.
  • Facilitate regular status meetings, design reviews, and updates to keep stakeholders informed and aligned.
  • Risk Management and Mitigation:
  • Identify, assess, and mitigate risks throughout the chip design lifecycle, including technical challenges, timeline delays, and resource constraints.
  • Create contingency plans to manage project risks and resolve issues promptly.
  • Stakeholder Communication:
  • Act as the primary point of contact for internal teams, external partners, and customers throughout the programs duration.
  • Manage communication between internal engineering teams, vendors, and customers, ensuring all parties are informed of progress, changes, and risks.
  • Resource Management:
  • Manage program resources, including engineering teams, tools, and external partners, to optimize project efficiency.
  • Work with management to forecast resource needs, manage budgets, and ensure optimal use of manpower and tools.
  • Documentation and Reporting:
  • Maintain detailed documentation on project deliverables, timelines, issues, and solutions.
  • Provide regular status reports to executive leadership, highlighting progress, risks, and budget status.
  • Customer Interface:
  • Collaborate with customer teams to clarify chip requirements, provide technical guidance, and ensure that design specifications meet customer needs.
  • Coordinate customer deliverables and ensure a smooth transition from development to production.
  • Post-Tape-Out Support:
  • Provide ongoing support after GDSII handoff, ensuring successful product verification, testing, and ramp-up into production.
  • Manage post-tape-out changes, including any necessary re-spins or design modifications, while minimizing impact on timelines and cost.

Qualifications and Skills:

  • Educational Background:
  • Bachelors or Masters degree in Electronics/Electrical/Computer Science. An MBA is a plus.
  • Experience:
  • 7+ years of experience in program or project management in the semiconductor industry, particularly in chip design (from RTL to GDSII).
  • Proven track record of managing complex VLSI/ASIC/SoC projects through multiple development phases.
  • Technical Knowledge:
  • Strong understanding of the chip design process, including RTL design, physical design, DFT, and tape-out processes.
  • Familiarity with EDA tools (e.g., Synopsys, Cadence, Mentor) and design methodologies.
  • Knowledge of semiconductor fabrication processes and post-GDSII phases such as validation and product engineering.
  • Project Management Skills:
  • Expertise in project management tools (e.g., MS Project, JIRA, or others).
  • Strong organizational skills and attention to detail.
  • Soft Skills:
  • Excellent verbal and written communication skills for both technical and non-technical audiences.
  • Strong leadership and interpersonal skills, capable of working across departments and with customers.
  • Proactive problem-solving abilities and experience in managing conflicts and change requests.
  • Certifications (Preferred):
  • PMP (Project Management Professional) certification or equivalent is a plus.
  • Knowledge of functional safety standards (ISO 26262) or industry-specific requirements like ASIL is a plus.

Why Join Us:

  • Be part of an innovative team driving the future of semiconductor technology.
  • Opportunity to work on cutting-edge chip designs for industries like automotive, consumer electronics, IoT, and more.
  • A dynamic and collaborative work environment with opportunities for growth and career advancement.

Job Classification

Industry: Electronic Components / Semiconductors
Functional Area / Department: Engineering - Hardware & Networks
Role Category: Hardware
Role: Hardware Engineering Manager
Employement Type: Full time

Contact Details:

Company: ACL Digital
Location(s): Bengaluru

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Keyskills:   Semiconductor SOC VLSI Design Program Management ASIC Post tap out support Risk Management End-to-End Program Management Product Testing Time Management Skills Project Management RDL to GDSII Development Cross Functional Teams Stakeholder Management

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Company DetailsVOLANSYS (An ACL Digital Company)